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Short course: thermal management and analysis of electronic equipment – 18/25/30/OCT/2017 – UPDATE

My honest atonement for the postponement of the course in the last minute. It was not my intention but a last minute disagreement with the college owner of Heshshev.

The intended short course shall be composed of three gatherings (TENZOR – authorised channel partner ANSYS, Rehovot, Eli-Horovitz street) 3.5 hours per gathering, evening hours (stats at 12:00). free for undergraduates and graduates! Each gathering shall be dedicated to focus on one of the following topics.

Part I: package level modeling and Thermal Interface Materials (TIMs).

Part II: board level modeling and cooling solutions.

Part III: Chassis level analysis, CFD and turbulence modeling and an objective review of commercial software packages.

The gatherings shall include a “hands on” demonstration of thermal analysis on a recommended thermal management dedicated commercial software – ANSYS (Mechnical thermal for PCB and ICEPAK for system level analysis) along with specific thermal solutions recommendations.

There shall be 10 open spots for the next course, so do be quick to enrol via whatsup message.

Dates:  18/25/30.10.17 – Please sign your place via whatsup message to 052-8330151.

For details please message me on private or email:

In collaboration dedicated thermal analysis softeare supplier TENZOR

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One comment on “Short course: thermal management and analysis of electronic equipment – 18/25/30/OCT/2017 – UPDATE

  1. Thank you, dear Tomer Avraham, all your posts are very interesting. You have a very good ability to explain complex things in a simple and understandable language. Definitely, I was happy to find your CFD ISRAEL – TOMER’S BLOG today and will certainly recommend it to my colleagues and especially students.

    Best Wishes,
    Eugene Shkvar (your colleague in CFD area of research activity from China (Jinhua, ZJNU))


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